DOI QR코드

DOI QR Code

A Study on the Formation of Air Bubble by the Droplet Volume and Dispensing Method in UV NIL

UV NIL공정에서 액적의 양과 도포방법에 따른 기포형성 연구

  • Lee, Ki Yeon (Department of Mechanical Engineering, SoonChunHyang University) ;
  • Kim, Kug Weon (Department of Mechanical Engineering, SoonChunHyang University)
  • 이기연 (순천향대학교 기계공학과) ;
  • 김국원 (순천향대학교 기계공학과)
  • Received : 2013.07.01
  • Accepted : 2013.09.06
  • Published : 2013.09.30

Abstract

Nanoimprint lithography (NIL) is an emerging technology enabling cost-effective and high-throughput nanofabrication. Recently, the major trends of NIL are high throughput and large area patterning. UV curable type NIL (UV NIL) can be performed at room temperature and low pressure. And one advantage of UV NIL is that it does not need vacuum, which greatly simplifies tool construction, so that vacuum oprated high-precision stages and a large vacuum chamber are no longer needed. However, one key issue in non-vacuum environment is air bubble formation problem. Namely, can the air bubbles be completely removed from the resist. In this paper, the air bubbles formation by the method of droplet application in UV NIL with non-vacuum environment are experimentally studied. The effects of the volume of droplet and the number of dispensing points on air bubble formation are investigated.

Keywords

Air bubble formation;Dispensing method;Droplet volume;Non-vacuum environment;UV NIL

References

  1. Chou, S. and Krauss, P., "Imprint lithography with sub-10nm feature size and high throughput," Microelectronic Engineering, Vol. 35, pp. 237-240, 1997. DOI: http://dx.doi.org/10.1016/S0167-9317(96)00097-4 https://doi.org/10.1016/S0167-9317(96)00097-4
  2. Guo, L. J., "Recent progress in nanoimprint technology and its applications," J. Phys. D: Appl. Phys., Vol. 37, pp. R123-R141, 2004. DOI: http://dx.doi.org/10.1088/0022-3727/37/11/R01 https://doi.org/10.1088/0022-3727/37/11/R01
  3. Kim, N. W., Kim, K. W., and Sin, H.-C., "Finite element analysis of low temperature thermal nanoimprint lithography using a viscoelastic model," Microelectronic Engineering, Vol. 85, pp. 1858-1865, 2008. DOI: http://dx.doi.org/10.1016/j.mee.2008.05.030 https://doi.org/10.1016/j.mee.2008.05.030
  4. Lee, K. Y., and, Kim, K. W., "A study on the filling process and residual layer formation in nanoimprint lithography process," Journal of the Korea Academia-Industrial coorperation Society, Vol. 13, No. 9, pp. 3835-3840, 2012. https://doi.org/10.5762/KAIS.2012.13.9.3835
  5. Kim, N. W., Kim, K. W., and Sin, H.-C., "A mathematical model for slip phenomenon in a cavity-filling process of nanoimprint lithography," Microelectronic Engineering, Vol. 86, pp. 2324-2329, 2009. DOI: http://dx.doi.org/10.1016/j.mee.2009.04.011 https://doi.org/10.1016/j.mee.2009.04.011
  6. Morihara, D., Hiroshima, H., and Hirai, Y., "Numerical study on bubble trapping in UV-nanoimprint lithography," Microelectronic Engineering, Vol. 86, No. 4-6, pp. 684-687, 2009. DOI: http://dx.doi.org/10.1016/j.mee.2008.12.005 https://doi.org/10.1016/j.mee.2008.12.005
  7. Nagaoka, Y., Morihara, D., Hiroshima, H., and Hirai, Y., "Simulation study on bubble trapping in UV nanoimprint lithography," Journal of Photopolymer Science and Technology, Vol. 22, No. 2, pp. 171-174, 2009. DOI: http://dx.doi.org/10.2494/photopolymer.22.171 https://doi.org/10.2494/photopolymer.22.171
  8. Hiroshima, H., Komuro, M., Kasahara, N., Kurashima, Y., and Taniguchi, J., "Elimination of pattern defects of nanoimprint under atmospheric condition," Japanese Journal of Applied Physics, Vol. 42, pp. 3849-3853, 2003. DOI: http://dx.doi.org/10.1143/JJAP.42.3849 https://doi.org/10.1143/JJAP.42.3849
  9. Hiroshima, H., and Komuro, M., 2007, "Control of bubble defects in UV nanoimprint," Japanese Journal of Applied Physics, Vol. 46, No. 9B, pp. 6391-6394. DOI: http://dx.doi.org/10.1143/JJAP.46.6391 https://doi.org/10.1143/JJAP.46.6391
  10. Liang, X., Tan, H., Fu, Z., and Chou, S. Y., "Air bubble formation and dissolution in dispensing nanoimprint lithography," Nanotechnology, Vol. 18, No. 2, pp. 1-7, 2007. DOI: http://dx.doi.org/10.1088/0957-4484/18/2/025303 https://doi.org/10.1088/0957-4484/18/2/025303
  11. Reddy, S., Schunk, P. R., and Bonnecaze, R. T., "Dynamics of low capillary number interfaces moving through sharp features," Physics of Fluids, Vol. 17, No. 12, pp. 122104-1-6, 2005. DOI: http://dx.doi.org/10.1063/1.2140691 https://doi.org/10.1063/1.2140691
  12. Reddy, S., and Bonnecaze, R. T., "Simulation of fluid flow in the step and flash imprint lithography process," Microelectronic Engineering, Vol. 82, No. 1, pp. 60-70, 2005. DOI: http://dx.doi.org/10.1016/j.mee.2005.06.002 https://doi.org/10.1016/j.mee.2005.06.002
  13. Seok, J.M. and Kim, N.W., "Analytic and numerical study for air bubble defect of UV-NIL process", Journal of the Korean Society of Manufacturing Technology Engineers, Vol. 21, No. 3, pp. 473-478, 2012. DOI: http://dx.doi.org/10.7735/ksmte.2012.21.3.473 https://doi.org/10.7735/ksmte.2012.21.3.473
  14. Yoo, S.H., "The 3D investigation of bubble defect during the fabrication of anti-reflective pattern through UV-NIL", M.D. Thesis, Seoul National University, 2012.