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Degradation Behavior of Solder Joint and Implementation Technology for Lead-free Automotive Electronics

자동차 전장제품의 무연솔더 적용기술 및 솔더 접합부 열화거동

  • Published : 2013.06.30

Abstract

Due to ELV banning, automotive electronics cannot use four kinds of heavy metal element (Pb, Hg, Cd, $Cr^{6+}$) from 2016. Therefore, this study was focused on degradation characteristics of Sn-3.0Ag-0.5Cu Lead-free solder joint with OSP and ENIG finsh under various reliability assessment method, as like to thermal shock test and high temeprature/high humidity test with test duration for cabin electronics. Also, we compared bonding strength degradation to other advanced research results of electronic control unit for engine room because of difference service temperature with mount location in automotive. Whisker growth phenomenon and mitigation method which were essentially consideration items for Pb-free car electronics were examined. Conformal coating is a strong candidate for mitigating whisker growth in automotive electronics. Necessary condition to adapt Pb-free in car electronics was shown.

Keywords

Automotive;Electronic control unit;Lead-free;Solder joint;Degradation;Whisker;Reliability

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  2. Oxidation and Repeated-Bending Properties of Sn-Based Solder Joints After Highly Accelerated Stress Testing (HAST) vol.14, pp.6, 2018, https://doi.org/10.1007/s13391-018-0077-3