Degradation Behavior of Solder Joint and Implementation Technology for Lead-free Automotive Electronics

자동차 전장제품의 무연솔더 적용기술 및 솔더 접합부 열화거동

  • Published : 2013.06.30


Due to ELV banning, automotive electronics cannot use four kinds of heavy metal element (Pb, Hg, Cd, $Cr^{6+}$) from 2016. Therefore, this study was focused on degradation characteristics of Sn-3.0Ag-0.5Cu Lead-free solder joint with OSP and ENIG finsh under various reliability assessment method, as like to thermal shock test and high temeprature/high humidity test with test duration for cabin electronics. Also, we compared bonding strength degradation to other advanced research results of electronic control unit for engine room because of difference service temperature with mount location in automotive. Whisker growth phenomenon and mitigation method which were essentially consideration items for Pb-free car electronics were examined. Conformal coating is a strong candidate for mitigating whisker growth in automotive electronics. Necessary condition to adapt Pb-free in car electronics was shown.


Automotive;Electronic control unit;Lead-free;Solder joint;Degradation;Whisker;Reliability


  1. EU Council, Directive 2002/95/EC of the European Parliament and of the Council, Restriction of the Use of Certain Hazardous Substances in Electrical and Electronic Equipment : The european parliament and the council fo the european union (2003)
  2. Commission Directive 2011/37/EU amending Annex II to Directive 2000/53/EC on end-of-life vehicles(ELV Directive), 2011, (2011)
  3. EU ELV Directive Bibliographic notice, http://eur-lex.,&pos=1&page=1&nbl=1&pgs=10&hword s= (2011)
  4. Carmine Meola : Pb-free Electronics Research Manhattan Project-Phase I, ACI Technology Inc. (2009)
  5. IPC 9701, Performance test methods and qualification requirements for surface mount solder attachments, (2002), 4
  6. Won Sik Hong, Gi-Young Goo and Un Hee Hwang : Verification Guideline of Pb-free Solder Joint Reliability for Military Electronics, Journal of KWJS, 30-3 (2012), 44-50
  7. Chulmin Oh, Nochang Park, Changwoon Han1, Mansoo Bang, and Wonsik Hong : The Interfacial Reactions and Reliability of SnAgCu Solder Joints under Thermal Shock Cycles, J. Kor. Inst. Met. & Mater., 47-8 (2009), 500-507 (in Korean)
  8. Chulmin Oh, Nochang Park, and Wonsik Hong : Solder Joints Fatigue Life of BGA Package with OSP and ENIG Surface Finish, J. Kor. Inst. Met. & Mater., 46-2 (2008), 80-87 (in Korean)
  9. 3. Anon : Copper-Tin Intermetallics, Circuit Manufacturing, 20-9 (1980), 56-64
  10. B. G. Le, and R. A. Baraczykowshi : Intermetallic Compound Growth on Tin and Solder Plating on Cu Alloys, Wire J. Int., 18-1 (1985), 66-71
  11. R. Strauss : SMT Soldering Handbook(2nd Edition), Newnes, Oxford (1998), 37-39
  12. H. A. H. Steen : Aging of Component Leads and Printed Circuit Boards, Research Report IM-1716, Swedish International for Metals Research (1982)
  13. A. Gangulee, G. C. Das, and M. B. Bever : An X-Ray Diffraction and Calorimetric Investigation of the Compound $Cu_6Sn_5$, Metal Transaction, 4 (1973), 2063-2066
  14. W. S. Hong, and K. B. Kim : Tafel Characteristics by Electrochemical Reaction of SnAgCu Pb-Free Solder, Korea Journal of Materials Research, 15-8 (2005), 536-542 (in Korean)
  15. JEITA : Lead Free Soldering Technologies-From Basic Matters to Measures for Solder Joint Lift-Off, Corona Publishing Co., Tokyo (2004), 26-29 (in Japanese)
  16. Won-Sik Hong, Whee-Sung Kim, Noh-Chang Park and Kwang-Bae Kim : Activation Energy for Intermetallic Compound Formation of Sn-40Pb/Cu and Sn-3.0Ag-0.5Cu/Cu Solder Joint, Journal of KWJS, 25-2 (2007), 49-55 (in Korean)
  17. Chulmin Oh, Nochang Park, and Wonsik Hong : Solder Joints Fatigue Life of BGA Package with OSP and ENIG Surface Finish, J. Kor. Inst. Met. & Mater., 46-2 (2008), 80-87
  18. Sanghun Jin, Namhyun Kang, Kyung-mox Cho, Changwoo Lee and Wonsik Hong : Behavior of Vibration Fracture for Sn-Ag-Cu-X Solders by Soldering, Journal of KWJS, 30-2 (2012), 169-173 (in Korean)
  19. Yong-Ho Ko, Sehoon Yoo and Chang-Woo Lee : Evaluation on Reliability of High Temperature Lead-free Solder for Automotive Electronics, Journal of the Microelectronics & Packaging Society, 17-4 (2010), 35-40 (in Korean)
  20. R. W. Johnson, J. L. Evans, P. Jacobsen, J. R. Thompson, and M. Christopher, "he Changing Automotive Environment: High-Temperature Electronics" IEEE Trans. Electron. Pack. Manu., 27-3 (2004), 164
  21. Sang-Su Ha, Seung-Boo Jung, et all : Thermo-Mechanical Reliability of Lead-free Surface Mount Assemblies for Auto-Mobile Application, Journal of KWJS, 24-6 (2006), 21-27 (in Korean)
  22. Won Sik Hong, Whee Sung Kim, Byeong Suk Song and Kwang-Bae Kim : Thermal Shock Cycles Optimization of Sn-3.0 Ag-0.5 Cu/OSP Solder Joint with Bonding Strength Variation for Electronic Components, Kor. J. Mater. Res., 17-3 (2007), 152-159 (in Korean)
  23. Won Sik Hong, Chul Min Oh, and Do Seop Kim : Mitigation and Verification Methods for Sn Whisker Growth in Pb-Free Automotive Electronics, Journal of Electronic Materials, 42-2 (2013), 332-347
  24. K. S. Kim, K. Hamasaki, K. J. Lee, A. Baated, K. Suganuma, M. Tsujimoto : Effects of the Sn plating structure and surface coating layer on Sn whikser growth, Proc. 19th Micro-Electronic Symposium, Fukuoka, Japan (2009), 65-68 (in Japanese)
  25. K.S. Kim, K. Suganuma, Y. Yorikado, K.J. Lee, A. Baated, M. Tsujimoto : Effect of Substrate Materials on Sn Whisker Growth, J. Japan Research Institute for Advanced Copper-base Materials and Technologies, 49 (2010), 112-115 (in Japanese)
  26. IPC-HDBK-830 : Guidelines for Design, Selection and Application of Conformal Coatings (2002)

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