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Direct Bonding of Cu/AlN using Cu-Cu2O Eutectic Liquid

Cu-Cu2O계 공융액상을 활용한 Cu/AlN 직접접합

  • Hong, Junsung (Department of Materials Science and Engineering, Seoul National University of Science and Technology) ;
  • Lee, Jung-Hoon (Department of Materials Science and Engineering, Seoul National University of Science and Technology) ;
  • Oh, You-Na (Department of Materials Science and Engineering, Seoul National University of Science and Technology) ;
  • Cho, Kwang-Jun (Department of Materials Science and Engineering, Seoul National University of Science and Technology) ;
  • Riu, Doh-Hyung (Department of Materials Science and Engineering, Seoul National University of Science and Technology) ;
  • Oh, Sung-Tag (Department of Materials Science and Engineering, Seoul National University of Science and Technology) ;
  • Hyun, Chang-Yong (Department of Materials Science and Engineering, Seoul National University of Science and Technology)
  • 홍준성 (서울과학기술대학교 신소재공학과) ;
  • 이정훈 (서울과학기술대학교 신소재공학과) ;
  • 오유나 (서울과학기술대학교 신소재공학과) ;
  • 조광준 (서울과학기술대학교 신소재공학과) ;
  • 류도형 (서울과학기술대학교 신소재공학과) ;
  • 오승탁 (서울과학기술대학교 신소재공학과) ;
  • 현창용 (서울과학기술대학교 신소재공학과)
  • Received : 2013.02.20
  • Accepted : 2013.04.16
  • Published : 2013.04.28

Abstract

In the DBC (direct bonding of copper) process the oxygen partial pressure surrounding the AlN/Cu bonding pairs has been controlled by Ar gas mixed with oxygen. However, the direct bonding of Cu with sound interface and good adhesion strength is complicated process due to the difficulty in the exact control of oxygen partial pressure by using Ar gas. In this study, we have utilized the in-situ equilibrium established during the reaction of $2CuO{\rightarrow}Cu_2O$ + 1/2 $O_2$ by placing powder bed of CuO or $Cu_2O$ around the Cu/AlN bonding pair at $1065{\sim}1085^{\circ}C$. The adhesion strength was relatively better in case of using CuO powder than when $Cu_2O$ powder was used. Microstructural analysis by optical microscopy and XRD revealed that the interface of bonding pair was composed of $Cu_2O$, Cu and small amount of CuO phase. Thus, it is explained that the good adhesion between Cu and AlN is attributed to the wetting of eutectic liquid formed by reaction of Cu and $Cu_2O$.

Acknowledgement

Supported by : 서울과학기술대학교

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