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Modeling and Prediction of Electromagnetic Immunity for Integrated Circuits

  • Pu, Bo (Dept. of Electrical and Electronics Engineering, Sungkyunkwan University) ;
  • Kim, Taeho (Dept. of Electrical and Electronics Engineering, Sungkyunkwan University) ;
  • Kim, SungJun (Dept. of Electrical and Electronics Engineering, Sungkyunkwan University) ;
  • Kim, SoYoung (Dept. of Semiconductor System Engineering, Sungkyunkwan University) ;
  • Nah, Wansoo (Dept. of Electrical and Electronics Engineering, Sungkyunkwan University)
  • Received : 2012.11.30
  • Accepted : 2013.02.22
  • Published : 2013.03.31

Abstract

An equivalent model has been developed to estimate the electromagnetic immunity for integrated circuits under a complex electromagnetic environment. The complete model is based on the characteristics of the equipment and physical configuration of the device under test (DUT) and describes the measurement setup as well as the target integrated circuits under test, the corresponding package, and a specially designed printed circuit board. The advantage of the proposed model is that it can be applied to a SPICE-like simulator and the immunity of the integrated circuits can be easily achieved without costly and time-consuming measurements. After simulation, measurements were performed to verify the accuracy of the equivalent model for immunity prediction. The improvement of measurement accuracy due to the added effect of a bi-directional coupler in the test setup is also addressed.

Keywords

Electromagnetic Immunity;Integrated Circuits;Modeling;Direct Power Injection

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