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A Study on Improving the Efficiency of a Heat Dissipation Design for 30 W COB LED Light Source

30 W COB LED광원의 효율 개선을 위한 방열설계에 관한 연구

  • Seo, BumSik (Department of Information & Communication Engineering, Wonkwang University) ;
  • Lee, KiJoung (Department of Information & Communication Engineering, Wonkwang University) ;
  • Cho, Young Seek (Department of Information & Communication Engineering, Wonkwang University) ;
  • Park, Dae-Hee (Department of Information & Communication Engineering, Wonkwang University)
  • Received : 2012.12.17
  • Accepted : 2013.01.03
  • Published : 2013.02.01

Abstract

In this paper, thermal analysis of heatsink for 30 W class Chip-on-Board (COB) LED light source is performed by using SolidWorks Flow Simulation package. In order to increase the convection heat transfer, number of fin and shape of the heatsink is optimized. Furthermore, a copper spread is applied between the COB LED light source and the heatsink to mitigate the heat concentration on the heatsink. With the copper spread, the junction temperature between the COB LED light source and the heatsink is $50.9^{\circ}C$, which is $5.4^{\circ}C$ lower than the heatsink without the copper spread. Due to the improvement of the junction temperature, the light output is improved by 5.8% when the LED light source is stabilized. The temperature difference between the simulation and measured result of the heatsink with the copper spread is within $2^{\circ}C$, which verifies the validity of the thermal design method using a simulation package.

Acknowledgement

Supported by : 중소기업청

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