DOI QR코드

DOI QR Code

Thermal Characteristics of the Optimal Design on 20W COB LED Down Light Heat Sink

  • Kwon, Jae-Hyun (Department of Information and Communication Engineering, Wonkwang University) ;
  • Lee, Jun-Myung (Department of Information and Communication Engineering, Wonkwang University) ;
  • Huang, Wei (School of Computer and Communication engineering, Tianjin University of Technology) ;
  • Park, Keon-Jun (Department of Information and Communication Engineering, Wonkwang University) ;
  • Kim, Yong-Kab (Department of Information and Communication Engineering, Wonkwang University)
  • 투고 : 2013.09.26
  • 발행 : 2013.11.30

초록

As the demand of the LED for lighting that emits light by p-n junction is increasing, studies on heatproof plate technology is being conducted to minimize the temperature of the LED lighting. As for the temperature of the LED devices, their light emitting efficiency decreases and the maximum lifespan drops down to 1/5. Therefore there are heat dissipation studies going on to minimize the heat. For LED heat dissipation, aluminum heat sink plates are mostly used. For this paper, we designed heat sink that fits residential 20W COB LED Down Light; packaged the heat sink and 20W COB and analyzed and evaluated the thermal properties through a Solidworks flow simulation. We are planning to design the optimal heat sink plate to solve the thermal agglomeration considering TIM(Thermal Interface material).

키워드

Heat sink;Solidworks Simulation;LED;Junction Temperature;Optimum Design

과제정보

연구 과제 주관 기관 : National Research Foundation of Korea (NRF)

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