# A Study on the Heat Radiation of LED Luminaires and the Indoor Temperature Increase

• 김동건 (한국해양대학교 전기전자공학부) ;
• 길경석 (한국해양대학교 전기전자공학부)
• Kim, Dong-Geon (Division of Electrical and Electronics Engineering, Korea Maritime University) ;
• Kil, Gyung-Suk (Division of Electrical and Electronics Engineering, Korea Maritime University)
• 투고 : 2012.07.31
• 심사 : 2012.08.13
• 발행 : 2012.09.01

#### 초록

This paper conducted a study on how the heat radiation of light emitting diode(LED) luminaires affects the indoor temperature increase. The effect was compared with that of a 20 W compact fluorescent lamp(CFL) and a 50 W MR16 halogen lamp which are most widely used inside of cruises, a LED downlight and a 4W MR16 LED replacing each of them. We installed a luminarie inside a thermally shielded chamber, measuring the temperature changes under the same volume every 5 minutes and compared the result with theoretically calculated heat radiation. The temperature changes in the chamber was measured four times, on seven hours' period in order to keep sufficient time once the temperature reaches the thermal equilibrium state. The results showed that the temperature of the 20 W E26 CFL and the 10 W LED downlight increased by $21.1^{\circ}C$ and $10.4^{\circ}C$ respectively, while that of the 50 W halogen MR16 and the 4 W LED MR16 increased by $33.9^{\circ}C$ and $4.8^{\circ}C$ respectively. The experimental heat radiation were calculated from the results and the experimental heat radiation of the CFL and the LED downlight were 171.5 cal and 86.5 cal, and those of the halogen MR16 and the LED MR16 were 275.3 cal and 36.5 cal. Therefore, the heat radiation was reduced by 49.5% and 86.7%, respectively, by replacing conventional light source with LED. In conclusion, we can expect a reduction of power consumption in air condition system and the effect on indoor temperature increase by application of LED luminaires.

#### 과제정보

연구 과제 주관 기관 : 정보통신산업진흥원

#### 참고문헌

1. DOE, Vision 2020: A Lighting Technology Roadmap, http://www.eren.doe.gov/builidngs/vision2020 (2001).
2. M. H. Crawford, IEEE Journal of Selected Topics in Quantum Electronics, 15, 1028 (2009). https://doi.org/10.1109/JSTQE.2009.2013476
3. W. H. Chi, T. L. Chou, C. N. Han, S. Y. Yang, and K. N. Chiang, IEEE Transactions on Components and Packaging Technologies, 33, 713 (2010). https://doi.org/10.1109/TCAPT.2010.2073469
4. I. T. Shin, J. K. Yang, D. J. Lee, and D. H. Park, J. KIEEME, 23, 471 (2010).
5. G. S. Kil, I. K. Kim, H. E. Cho, H. S. Kwon, and H. G. Cho, J. KOSME, 35, 654 (2011).
6. Y. K. Hwang, Jounal of the Electrical World Monthly, 405, 41 (2010).
7. S. J. Kim, D. G. Kim, I. K. Kim, and G. S. Kil, Proc. the Kieeme Annual Summer Conf., (eds. D. H. Park) (KIEEME, Gangneung, Korea, 2012) p. 276.
8. D. G. Kim, C. H. Jin, J. Y. Lee, H. E. Jo, and G. S. Kil, Proc. the Kieeme Annual Summer Conf., (eds. D. H. Park) (KIEEME, Gangneung, Korea, 2012) p. 277.
9. K. H. Koo, H. K. Lee, J. W. Choi, and J. K. Lee, J. SNAK, 48, 62 (2011). https://doi.org/10.3744/SNAK.2011.48.1.62
10. L. E. Sulfstede, IEEE Transactions on Industry Applications, 29, 300 (1993). https://doi.org/10.1109/28.216536
11. M. S. Kim, H. S. Kim, J. AIK, 13, 263 (1997).