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전단 모드 압전 에너지 하베스팅용 친환경 세라믹 소재

Eco-friendly Ceramic Materials for Shear Mode Piezoelectric Energy Harvesting

  • 한승호 (전자부품연구원 전자소재응용연구센터) ;
  • 박휘열 (전자부품연구원 전자소재응용연구센터) ;
  • 강형원 (전자부품연구원 전자소재응용연구센터) ;
  • 이형규 (전자부품연구원 전자소재응용연구센터)
  • Han, Seung-Ho (Electronic Materials and Device Research Center, Korea Electronics Technology Institute) ;
  • Park, Hwi-Yeol (Electronic Materials and Device Research Center, Korea Electronics Technology Institute) ;
  • Kang, Hyung-Won (Electronic Materials and Device Research Center, Korea Electronics Technology Institute) ;
  • Lee, Hyeung-Gyu (Electronic Materials and Device Research Center, Korea Electronics Technology Institute)
  • 투고 : 2012.07.05
  • 심사 : 2012.08.01
  • 발행 : 2012.09.01

초록

Eco-friendly $(Na,K)NbO_3$ (NKN)-based piezoelectric ceramic materials were fabricated by conventional ceramic method for shear mode piezoelectric energy harvesting application. $NKN-LiTaO_3$ (LT) based compositions were adopted for the high $d_{15}{\times}g_{15}$ which is proportional to harvested energy density. The composition $0.935(Na_{0.535}K_{0.485})NbO_3-0.065LiTaO_3$ was found to be lie on the boundary of tetragonal and orthorhombic phases. With reducing Ta content, the dielectric constant decreased gradually while maintaining high $d_{15}$, which resulted in increased $d_{15}{\times}g_{15}$. The composition $0.935(Na_{0.535}K_{0.485})NbO_3-0.065Li(Nb_{0.990}Ta_{0.010})O_3$ was found to possess excellent piezoelectric and electromechanical properties ($d_{15}{\times}g_{15}=29\;pm^2/N$, $d_{15}$ = 417 pC/N, $k_{15}$ = 0.55), and high curie temperature ($T_c=455^{\circ}C$).

참고문헌

  1. B. Jaffe, W. R. Cook, and H. Jaffe, Piezoelectric Ceramics (Academic Press, London and NewYork, 1971) p. 140.
  2. Y. Saito, H. Takao, T. Tani, T. Nonoyama, K. Takatomi, T. Homma, T. Nagaya, and M. Nakamura, Nature, 432, 84 (2004). https://doi.org/10.1038/nature03028
  3. Y. Guo, K. Kakimoto, and H. Osato, Appl. Phys. Lett., 85, 4121 (2004). https://doi.org/10.1063/1.1813636
  4. G. Z. Zang, J. F. Wang, H. C. Chen, W. B. Su, C. M. Wang, P. Qi, B. Q. Ming, J. Du, L. M. Zheng, S. Zhang, and T. R. Shrout, Appl. Phys. Lett., 88, 212908 (2006). https://doi.org/10.1063/1.2206554
  5. H. Y. Park, C. W. Ahn, H. C. Song, J. H. Lee, S. Nahm, K. Uchino, H. G. Lee, and H. J. Lee, Appl. Phys. Lett., 89, 062906 (2006). https://doi.org/10.1063/1.2335816
  6. S. Priya, J. Electroceram., 19, 165 (2007).
  7. P. Zhao, B. P. Zhang, and J. F. Li, Appl. Phys. Lett., 90, 242909 (2007). https://doi.org/10.1063/1.2748088
  8. G. Z. Zang, J. F. Wang, H. C. Chen, W. B. Su, C. M. Wang, P. Qi, B. Q. Ming, J. Du, L. M. Zheng, S. Zhang, and T. R. Shrout, Appl. Phys. Lett., 88, 212908 (2006). https://doi.org/10.1063/1.2206554
  9. J. Wu, D. Xiao, Y. Wang, J. Zhu, and P. Yu, J. Appl. Phys., 103, 024102 (2008). https://doi.org/10.1063/1.2830997
  10. P. Zhao, B. Ping, Zhang, and J. F. Li, Scripta Materialia, 58, 429 (2008). https://doi.org/10.1016/j.scriptamat.2007.10.028
  11. P. Zhao, B. Ping, Zhang, and J. F. Li, Appl. Phys. Lett., 91, 172901 (2007). https://doi.org/10.1063/1.2794405
  12. Z. Y. Shen, K. Wang, and J. F. Li, Appl. Phys., A 97, 911 (2009). https://doi.org/10.1007/s00339-009-5358-0
  13. R. Zuo, S. Su, J. Fu, and Z. Xu, J. Mater. Sci: Mater. Electron., 20, 469 (2009).
  14. Y. Guo, J. Kakimoto, and H. Ohsato, Mater. Lett., 59, 241 (2005). https://doi.org/10.1016/j.matlet.2004.07.057
  15. D. W. Wu, R. M. Chen, Q. F. Zhou, K. K. Shung, D. M. Lin, H. L. W. Chan, Ultrasonics, 49, 153 (2009). https://doi.org/10.1016/j.ultras.2008.09.004
  16. Y. Chang, Z. Yang, D. Ma, Z. Liu, and Z. Wang, J. Appl. Phys., 105, 054101 (2009). https://doi.org/10.1063/1.3081643
  17. J. Hong, J. Yoo, K. Lee, S. Lee, and H. Song, Jpn. J. Appl. Phys., 47, 2192 (2008). https://doi.org/10.1143/JJAP.47.2192
  18. J. Du, J. F. Wang, G. Z. Zang, P. Qi, S. J. Zhang, and T. R. Shrout, Chin. Phys. Lett., 25, 1446 (2008). https://doi.org/10.1088/0256-307X/25/4/076
  19. B. Q. Ming, J. F. Wang, P. Qi, and G. Z. Zang, J. Appl. Phys., 101, 054103 (2007). https://doi.org/10.1063/1.2436923