Fabrication of Environmental-friendly Materials Using Atomic Layer Deposition

원자층 증착을 이용한 친환경 소재의 제조

  • Published : 2012.02.10


In this article, I will introduce recent developments of environmental-friendly materials fabricated using atomic layer deposition (ALD). Advantages of ALD include fine control of the thin film thickness and formation of a homogeneous thin fim on complex-structured three-dimensional substrates. Such advantages of ALD can be exploited for fabricating environmental-friendly materials. Porous membranes such as anodic aluminum oxide (AAO) can be used as a substrate for $TiO_2$ coating with a thickness of about 10 nm, and the $TiO_2$-coated AAO can be used as filter of volatile organic compound such as toluene. The unique structural property of AAO in combination with a high adsorption capacity of amorphous $TiO_2$ can be exploited in this case. $TiO_2$ can be also deposited on nanodiamonds and Ni powder, which can be used as photocatalyst for degradation of toluene, and $CO_2$ reforming of methane catalyst, respectively. One can produce structures, in which the substrates are only partially covered by $TiO_2$ domains, and these structures turns out to be catalytically more active than bare substrates, or complete core-shell structures. We show that the ALD can be widely used not only in the semiconductor industry, but also environmental science.


atomic layer deposition;volatile organic compound;adsorption;catalysis;$TiO_2$


  1. D. M. King, X. Liang, Y. Zhou, C. S. Carney, L. F. Hakim, P. Li, and A. W. Weimer, Powder Technol., 183, 356 (2008). https://doi.org/10.1016/j.powtec.2008.01.025
  2. X. Jiang, T. N. Gur, F. B. Prinz, and S. F. Bent, Chem. Mater., 22, 3024 (2010). https://doi.org/10.1021/cm902904u
  3. S. M. George, Chem. Rev., 110, 111 (2010). https://doi.org/10.1021/cr900056b
  4. R. L. Puurunen, M. Lindblad, A. Root, and A. O. I. Krause, Phys. Chem. Chem. Phys., 3, 1093 (2001). https://doi.org/10.1039/b007249o
  5. D. S. Bhatkhande, V. G. Pangarkar, and A. Beenackers, J. Chem. Technol. Biotechnol., 77, 102 (2002). https://doi.org/10.1002/jctb.532
  6. S. Mudliar, B. Giri, K. Padoley, D. Satpute, R. Dixit, P. Bhatt, R. Pandey, A. Juwarkar, and A. Vaidya, J. Environ. Manage., 91, 1039 (2011).
  7. G. Busca, S. Berardinelli, C. Resini, and L. Arrighi, J. Hazard. Mater., 160, 265 (2008). https://doi.org/10.1016/j.jhazmat.2008.03.045
  8. J. Nikiema, P.-A. Dastous, and M. Heitz, Rev. Environ. Health, 22, 273 (2007). https://doi.org/10.1515/REVEH.2007.22.4.273
  9. H. J. Lee, H. O. Seo, D. W. Kim, K.-D. Kim, L. Yuan, D. C. Lim, H. K. Ju, J. W. Kim, J. Lee, and Y. D. Kim, Chem. Comm., 47, 5605 (2011). https://doi.org/10.1039/c1cc10307e
  10. K.-D. Kim, N. K. Dey, H. O. Seo, Y. D. Kim, D. Lim, and M. Lee, Appl. Cataly. A., 408, 148 (2011). https://doi.org/10.1016/j.apcata.2011.09.019
  11. D. W. Kim, K.-D. Kim, H. O. Seo, N. K. Dey, M. J. Kim, Y. D. Kim, D. C. Lim, and K. H. Lee, Catal. Lett., 141, 854 (2011). https://doi.org/10.1007/s10562-011-0601-7
  12. H. Masuda and K. Fukuda, Science, 268, 1466 (1995). https://doi.org/10.1126/science.268.5216.1466
  13. X. B. Chen, L. Liu, P. Y. Yu, and S. S. Mao, Science, 331, 746 (2011). https://doi.org/10.1126/science.1200448
  14. X. B. Chen and S. S. Mao, Chem. Rev., 107, 2891 (2007). https://doi.org/10.1021/cr0500535
  15. R. Mendez-Roman and N. Cardona-Martinez, Catal. Today, 40, 353 (1998). https://doi.org/10.1016/S0920-5861(98)00064-9
  16. G. Marci, M. Addamo, V. Augugliaro, S. Coluccia, E. Garcia-Lopez, V. Loddo, G. Martra, L. Palmisano, and M. Schiavello, J. Photochem. Photobiol. A Chem., 160, 105 (2003). https://doi.org/10.1016/S1010-6030(03)00228-4
  17. L. Cao, Z. Gao, S. L. Suib, T. N. Obee, S. O. Hay, and J. D. Freihaut, J. Catal., 196, 253 (2000). https://doi.org/10.1006/jcat.2000.3050
  18. F.-L. Cao, J.-G. Wang, F.-J. Lv, D.-Q. Zhang, Y.-N. Huo, G.-S. Li, H.-X. Li, and J. Zhu, Catal. Commun., 12, 946 (2011). https://doi.org/10.1016/j.catcom.2011.03.007
  19. J. R. H. Ross, Catal. Today, 100, 151 (2005). https://doi.org/10.1016/j.cattod.2005.03.044