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Microstructural Evolution during Hot Deformation of P/M Copper using Processing Map

변형지도 모델링을 통한 구리 분말 소결체의 고온 변형에 따른 미세조직 연구

  • Chang, Soo-Ho (School of Material Science and Metallurgical Engineering, Kyungpook National University) ;
  • Kim, Young-Moo (Defense Material and Evaluation Technology Directorate, Agency for Defense Development) ;
  • Park, Kyung-Chae (School of Material Science and Metallurgical Engineering, Kyungpook National University)
  • 장수호 (경북대학교 금속공학과) ;
  • 김영무 (국방과학연구소 국방소재기술부) ;
  • 박경채 (경북대학교 금속공학과)
  • Received : 2012.02.04
  • Accepted : 2012.03.13
  • Published : 2012.04.28

Abstract

P/M coppers are subjected to the isothermal compression tests at the strain rate ranging from 0.01 to 10.0 $s^{-1}$ and the temperature from 200 to $800^{\circ}C$. The processing map reveals the dynamic recrystallization (DRX) domain in the following temperature and strain rate ranges: $600-800^{\circ}C$ and 0.01-10.0 $s^{-1}$, respectively. In the domain, the region at temperature of $600^{\circ}C$ and strain rate of $10^{-2}s^{-1}$ shows peak efficiency. From the kinetic analysis, the apparent activation energy in the DRX domain is 190.67 kJ/mol and it suggests that lattice self-diffusion is the rate controlling mechanism.

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Cited by

  1. Hot Deformation Behavior and Microstructural Evolution of Powder Metallurgy Ti-6Al-4V Alloy vol.21, pp.4, 2014, https://doi.org/10.4150/KPMI.2014.21.4.277