- Volume 27 Issue 6
DOI QR Code
Evaluation of the Joint Strength of Lead-free Solder Ball Joints at High Strain Rates
고속 변형률 속도에서의 무연 솔더 볼 연결부의 강도 평가
- Received : 2012.03.02
- Accepted : 2012.12.13
- Published : 2012.12.31
A lack of study on the dynamic tensile strengths of Sn-based solder joints at high strain rates was the motivation for the present study. A modified miniature Charpy impact testing machine instrumented with an impact sensor was built to quantitatively evaluate the dynamic impact strength of a solder joint under tensile impact loading. This study evaluated the tensile strength of lead-free solder ball joints at strain rates from
dynamic tensile strength;lead-free solder joint;interface failure;modified charpy impact testing machin
- V. Sivasubramaniam, M. Galli, J. Cugnoni, J. Janczak- Rusch and J. Botsis, " A study of the shear response of a lead-free composite solder by experimental and homogenization techniques,"J. Elect. Mater. Vol. 38, No. 10, pp. 2122-2131, 2009. https://doi.org/10.1007/s11664-009-0878-0
- X. Deng, R.S. Sidhu and P. Johnson, N. Chawla, "Influence of reflow and thermal aging on the shear strength and fracture behavior of Sn-3.5Ag solder/Cu joints," Metal. Mater. Trans. A, Vol. 36A, pp. 55-64, 2005.
- W.H. Bang, C.U. Kim, S.H. Kang and K.H. Oh, "Fracture mechanics of solder bump during ball shear testing: effect of bump size,"J. Electronic. Mat. Vol. 38, No. 9, pp. 1896-1905, 2009. https://doi.org/10.1007/s11664-009-0842-z
- M. Date, T. Shoji, M. Fujiyoshi, K. Sato and K.N. Tu, "Ductile-to-brittle transition in Sn-Zn solder joints measured by impact test," Scripta Mater. Vol. 51, pp. 641- 645, 2004. https://doi.org/10.1016/j.scriptamat.2004.06.027
- C.R. Siviour, D.M. Williamson, S.J.P. Palmer, S.M. Walley, W.G. Proud and J.E. Field, "Dynamic properties of solders and solder joints,"J. Physics IV, Vol. 110, pp. 477-482, 2003.
- Y.S. Lai, H.C. Chang and C.L. Yeh. "Evaluation of solder joint strengths under ball impact test," Microelectron. Reliab. Vol. 47, pp. 2179-2187, 2007. https://doi.org/10.1016/j.microrel.2006.11.015
- 주세민, 김호경, "초소형 무연 단일 솔더볼 연결부의 전단강도 평가,"한국안전학회지, Vol. 25, No. 6, pp. 14-21, 2010.
- T. Kobayashi, A. Lee and K.N. Subramanian, "Impact behavior of thermomechanically fatigued Sn-based solder joints,"J. Electronic. Mat. Vol. 38, No.12, pp. 2659- 2667, 2009. https://doi.org/10.1007/s11664-009-0890-4
- M.S. Yeh and J.T. Chiang, "Tensile test behavior of the eutectic Sn-Ag solder joint in ball grid array assemblies," Metal. Mater. Trans. A, Vol. 35A, pp. 3817-3821, 2004.
- R. Darveaux and C. Reichman, "Ductile-to-brittle transition strain rate," Proc. Elect Pack Tech Conf IEEE 2006, pp. 283-289, 2006.
- E.H. Wong, S.K.W. Seah and V.P.W. Shim, " A review of board level solder joints for mobile applications," Microelectro. Reliab. Vol. 48, pp. 1747-1758, 2008. https://doi.org/10.1016/j.microrel.2008.08.006
Supported by : 서울과학기술대학교