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Evaluation of the Joint Strength of Lead-free Solder Ball Joints at High Strain Rates

고속 변형률 속도에서의 무연 솔더 볼 연결부의 강도 평가

  • Received : 2012.03.02
  • Accepted : 2012.12.13
  • Published : 2012.12.31

Abstract

A lack of study on the dynamic tensile strengths of Sn-based solder joints at high strain rates was the motivation for the present study. A modified miniature Charpy impact testing machine instrumented with an impact sensor was built to quantitatively evaluate the dynamic impact strength of a solder joint under tensile impact loading. This study evaluated the tensile strength of lead-free solder ball joints at strain rates from $1.8{\times}10^3s^{-1}$ and $8.5{\times}10^3s^{-1}$. The maximum tensile strength of the solder ball joint decreases as the load speed increases in the testing range. This tensile strength represented that of the interface because of the interfacial fracture site. The tensile strengths of solder joints between Sn-3.0Ag-0.5Cu and copper substrate were between 21.7 MPa and 8.6 MPa in the high strain range.

Keywords

dynamic tensile strength;lead-free solder joint;interface failure;modified charpy impact testing machin

References

  1. V. Sivasubramaniam, M. Galli, J. Cugnoni, J. Janczak- Rusch and J. Botsis, " A study of the shear response of a lead-free composite solder by experimental and homogenization techniques,"J. Elect. Mater. Vol. 38, No. 10, pp. 2122-2131, 2009. https://doi.org/10.1007/s11664-009-0878-0
  2. X. Deng, R.S. Sidhu and P. Johnson, N. Chawla, "Influence of reflow and thermal aging on the shear strength and fracture behavior of Sn-3.5Ag solder/Cu joints," Metal. Mater. Trans. A, Vol. 36A, pp. 55-64, 2005.
  3. W.H. Bang, C.U. Kim, S.H. Kang and K.H. Oh, "Fracture mechanics of solder bump during ball shear testing: effect of bump size,"J. Electronic. Mat. Vol. 38, No. 9, pp. 1896-1905, 2009. https://doi.org/10.1007/s11664-009-0842-z
  4. M. Date, T. Shoji, M. Fujiyoshi, K. Sato and K.N. Tu, "Ductile-to-brittle transition in Sn-Zn solder joints measured by impact test," Scripta Mater. Vol. 51, pp. 641- 645, 2004. https://doi.org/10.1016/j.scriptamat.2004.06.027
  5. C.R. Siviour, D.M. Williamson, S.J.P. Palmer, S.M. Walley, W.G. Proud and J.E. Field, "Dynamic properties of solders and solder joints,"J. Physics IV, Vol. 110, pp. 477-482, 2003.
  6. Y.S. Lai, H.C. Chang and C.L. Yeh. "Evaluation of solder joint strengths under ball impact test," Microelectron. Reliab. Vol. 47, pp. 2179-2187, 2007. https://doi.org/10.1016/j.microrel.2006.11.015
  7. 주세민, 김호경, "초소형 무연 단일 솔더볼 연결부의 전단강도 평가,"한국안전학회지, Vol. 25, No. 6, pp. 14-21, 2010.
  8. T. Kobayashi, A. Lee and K.N. Subramanian, "Impact behavior of thermomechanically fatigued Sn-based solder joints,"J. Electronic. Mat. Vol. 38, No.12, pp. 2659- 2667, 2009. https://doi.org/10.1007/s11664-009-0890-4
  9. M.S. Yeh and J.T. Chiang, "Tensile test behavior of the eutectic Sn-Ag solder joint in ball grid array assemblies," Metal. Mater. Trans. A, Vol. 35A, pp. 3817-3821, 2004.
  10. R. Darveaux and C. Reichman, "Ductile-to-brittle transition strain rate," Proc. Elect Pack Tech Conf IEEE 2006, pp. 283-289, 2006.
  11. E.H. Wong, S.K.W. Seah and V.P.W. Shim, " A review of board level solder joints for mobile applications," Microelectro. Reliab. Vol. 48, pp. 1747-1758, 2008. https://doi.org/10.1016/j.microrel.2008.08.006

Acknowledgement

Supported by : 서울과학기술대학교