Journal of the Korean Institute of Electrical and Electronic Material Engineers (한국전기전자재료학회논문지)
- Volume 24 Issue 11
- /
- Pages.900-904
- /
- 2011
- /
- 1226-7945(pISSN)
- /
- 2288-3258(eISSN)
DOI QR Code
Analysis of An Anomalous Hump Phenomenon in Low-temperature Poly-Si Thin Film Transistors
저온 다결정 실리콘 박막 트랜지스터의 비정상적인 Hump 현상 분석
- Kim, Yu-Mi (Department of Electronics Engineering, Chungnam National University) ;
-
Jeong, Kwang-Seok
(Department of Electronics Engineering, Chungnam National University) ;
-
Yun, Ho-Jin
(Department of Electronics Engineering, Chungnam National University) ;
-
Yang, Seung-Dong
(Department of Electronics Engineering, Chungnam National University) ;
-
Lee, Sang-Youl
(Department of Electronics Engineering, Chungnam National University) ;
-
Lee, Hi-Deok
(Department of Electronics Engineering, Chungnam National University) ;
-
Lee, Ga-Won
(Department of Electronics Engineering, Chungnam National University)
- 김유미 (충남대학교 전자공학과) ;
-
정광석
(충남대학교 전자공학과) ;
-
윤호진
(충남대학교 전자공학과) ;
-
양승동
(충남대학교 전자공학과) ;
-
이상율
(충남대학교 전자공학과) ;
-
이희덕
(충남대학교 전자공학과) ;
-
이가원
(충남대학교 전자공학과)
- Received : 2011.08.30
- Accepted : 2011.09.26
- Published : 2011.11.01
Abstract
In this paper, we investigated an anomalous hump phenomenon under the positive bias stress in p-type LTPS TFTs. The devices with inferior electrical performance also show larger hump phenomenon. which can be explained by the sub-channel induced from trapped electrons under thinner gate oxide region. We can confirm that the devices with larger hump have larger interface trap density (
File
Acknowledgement
Supported by : 한국과학재단
References
- T. Serikawa, S. Shirai, A. Okamoto, and S. Suyama, IEEE Trans. Elec. Dev., 36, 1929 (1989). https://doi.org/10.1109/16.34272
- K. Chung, M. P. Hong, C. W. Kim, and I. Kang, IEDM Tech. Dig., 385 (2002).
- Y. C. Wu, T. C. Chang, P. T. Liu, C. S. Chen, C. H. Tu, H. W. Zan, Y. H. Tai, and C. Y. Chang, IEEE Trans. Elec. Dev., 52, 2343 (2005). https://doi.org/10.1109/TED.2005.856797
- M. W. Ma, C. Y. Chen, W. C. Wu, C. J. Su, K. H. Kao, T. S. Chao, and T. F. Lei, IEEE Trans. Elec. Dev., 55, 1153 (2008). https://doi.org/10.1109/TED.2008.919710
- J. G. Fossum, A. Oritz-Vonde, H. Shichijo, and S. K. Banerjee, IEEE Trans. Elec. Dev., 32, 1878 (1985). https://doi.org/10.1109/T-ED.1985.22212
- H. C Kim and Y. H. Roh, J. KIEEME, 21, 213 (2008).
- C. F. Huang, C. Y. Peng, Y. J. Yang, H. C. Sun, H. C. Chang, P. S. Kuo, H. L. Chang, C. Z. Liu, and C. W. Liu, IEEE Electron Device Lett., 29, 1332 (2008). https://doi.org/10.1109/LED.2008.2007306
- W. K. Park, J. H. Lee, and G. Lim, IEEE Electron Device Lett., 25, 532 (2004). https://doi.org/10.1109/LED.2004.832121
- C. T. Tsai, T. C. Chang, S. C. Chen, I. Lo, S. W. Tsao, M. C. Hung, J. J. Chang, C. Y. Wu, and C. Y. Huang, Appl. Phys. Lett., 96, 242105 (2010). https://doi.org/10.1063/1.3453870
- M. Mativenga, M. H. Choi, J. Jang, R. Mruthyunjaya, T. J. Tredwell, E. Mozdy, and C. K. Williams, IEEE Trans. Elec. Dev., 58, 2440 (2011). https://doi.org/10.1109/TED.2011.2155068
- H. R. Park, D. Kwon, and J. D. Cohen, J. Appl. Phys., 83, 8051 (1998). https://doi.org/10.1063/1.367898
- C. S. Lin, Y. C. Chen, T. C. Chang, H. W. Li, S. C. Chen, F. Y. Jian, Y. S. Chuang, T. C. Chen, Y. C. Chen, and Y. H. Tai, J. Electrochem. Soc., 157, H1003 (2010). https://doi.org/10.1149/1.3483759
- Sigurd Wagner and C. N. Berglund, Rev. Sci. Instrum., 43, 1775 (1972). https://doi.org/10.1063/1.1685562
- J. Levinson, F. R. Shepherd, P. J. Scanlon, W. D. Westwood, G. Este, and M. Rider, J. Appl. Phys., 53, 1193 (1982). https://doi.org/10.1063/1.330583
- R. E. Proano, R. S. Misage, D. G. Ast, IEEE Trans. Elec. Dev., 36, 1915 (1989). https://doi.org/10.1109/16.34270
- R. L. Weisfield and D. A. Anderson, Phil. Mag. B 44, 83 (1981). https://doi.org/10.1080/01418638108222369