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Fabrication and Characterization of NiMn2O4 NTC Thermistor Thick Films by Aerosol Deposition

상온 진공 분말 분사법에 의한 NiMn2O4계 NTC Thermistor 후막제작 및 특성평가

Baek, Chang-Woo;Han, Gui-fang;Hahn, Byung-Dong;Yoon, Woon-Ha;Choi, Jong-Jin;Park, Dong-Soo;Ryu, Jung-ho;Jeong, Dae-Yong
백창우;한귀팡;한병동;윤운하;최종진;박동수;류정호;정대용

  • Received : 2011.02.28
  • Accepted : 2011.04.13
  • Published : 2011.05.27

Abstract

Negative temperature coefficient (NTC) materials have been widely studied for industrial applications, such as sensors and temperature compensation devices. NTC thermistor thick films of $Ni_{1+x}Mn_{2-x}O_{4+{\delta}}$ (x = 0.05, 0, -0.05) were fabricated on a glass substrate using the aerosol deposition method at room temperature. Resistance verse temperature (R-T) characteristics of the as-deposited films showed that the B constant ranged from 3900 to 4200 K between $25^{\circ}C$ and $85^{\circ}C$ without heat treatment. When the film was annealed at $600^{\circ}C$ 1h, the resistivity of the film gradually decreased due to crystallization and grain growth. The resistivity and the activation energy of films annealed at $600^{\circ}C$ for 1 h were 5.203, 5.95, and 4.772 $K{\Omega}{\cdot}cm$ and 351, 326, and 299 meV for $Ni_{0.95}Mn_{2.05}O_{4+{\delta}}$, $NiMn_2O_4$, and $Ni_{1.05}Mn_{1.95}O_{4+{\delta}}$, respectively. The annealing process induced insulating $Mn_2O_3$ in the Ni deficient $Ni_{0.95}Mn_{2.05}O_{4+{\delta}}$ composition resulting in large resistivity and activation energy. Meanwhile, excess Ni in $Ni_{1.05}Mn_{1.95}O_{4+{\delta}}$ suppressed the abnormal grain growth and changed $Mn^{3+}$ to $Mn^{4+}$, giving lower resistivity and activation energy.

Keywords

$\underline{thermistor}$;$\underline{negative\temperature\coefficient\(NTC)}$;aerosol deposition;thick film

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