The Research of Ni Electroless Plating for Ni/Cu Front Metal Solar Cells

Ni/Cu 금속전극 태양전지의 Ni electroless plating에 관한 연구

  • Lee, Jae-Doo (Department of Electronics Engineering, Sejong University) ;
  • Kim, Min-Jeong (Department of Electronics Engineering, Sejong University) ;
  • Kim, Min-Jeong (Department of Electronics Engineering, Sejong University) ;
  • Lee, Soo-Hong (Department of Electronics Engineering, Sejong University)
  • 이재두 (세종대학교 전자공학과) ;
  • 김민정 (세종대학교 전자공학과) ;
  • 권혁용 (세종대학교 전자공학과) ;
  • 이수홍 (세종대학교 전자공학과)
  • Received : 2011.01.17
  • Accepted : 2011.02.22
  • Published : 2011.04.01


The formation of front metal contact silicon solar cells is required for low cost, low contact resistance to silicon surface. One of the front metal contacts is Ni/Cu plating that it is available to simply and inexpensive production to apply mass production. Ni is shown to be a suitable barrier to Cu diffusion into the silicon. The process of Ni electroless plating on front silicon surface is performed using a chemical bath. Additives and buffer agents such as ammonium chloride is added to maintain the stability and pH control of the bath. Ni deposition rate is found to vary with temperature, time, utilization of bath. The experimental result shown that Ni layer by SEM (scanning electron microscopy) and EDX analysis. Finally, plated Ni/Cu contact solar cell result in an efficiency of 17.69% on $2{\times}2\;cm^2$, Cz wafer.


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