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Development of White LED Lamp Having High Color Uniformity With Transfer Molding Technology

트랜스퍼 몰딩 방식을 이용한 고 색 균일성 특성을 가지는 백색 LED 램프

  • 유순재 (선문대학교 전자공학과, (주)희성전자) ;
  • 김도형 (선문대학교 전자공학과, (주)희성전자)
  • Published : 2010.01.01

Abstract

Compared to conventional molding technology, the color uniformity of light direction emitted from LED is improved with PCB type lead frame technology in which metal thin film is used and transfer molding technology which makes the density of phosphor uniform by manufacturing high density LED lamp. The light efficiency and the color uniformity of the LED are improved by molding the phosphor layer outside of chip and controlling the thickness of the phosphor layer. CIE x,y difference of LED in major axis is also improved uniformly from 0 to 90 degrees.

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Cited by

  1. Reflection Characteristics of Electroplated Deposits on LED Lead frame with Plating Condition vol.20, pp.2, 2013, https://doi.org/10.6117/kmeps.2013.20.2.029