Control of Contact Angle by Surface Treatment using Sanning Plasma Method

주사 플라즈마 법(SPM)을 이용한 소수성 표면처리

  • 김영기 (전북대학교 전기공학과) ;
  • 최병정 (전북대학교 전기공학과) ;
  • 양성채 (전북대학교 전기공학과)
  • Published : 2010.01.01


The plasma processing technologies of thin film deposition and surface treatment technique have been applied to many industrial fields. This study is purposed Large-area uniformity and surface treatment on the stainless substrate. We treat surface of stainless by $CF_4$ plasma. $CF_4$ plasma is generated by using SPM(Scanning plasma method)which is kind a of CVD. Generally, SPM has been used for uniform surface treatment using a crossed electromagnetic field. The optimum discharge condition has been studied for the gas pressure, the magnetic flux density and the distance between substrate and electrodes. In result, contact angle is increased by surface treatment using $CF_4$ Plasma. Therefore we expect that SPM to control contact angle is applied to many industries.


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