Analysis Method of Signal Integrity for Mobile Display Circuit Modules

모바일 디스플레이 회로 모듈의 시그널 인티그리티 해석 기법

  • Lee, Yong-Min (Dept. of Information Display, Sun Moon University)
  • 이용민 (선문대학교 정보디스플레이학과)
  • Published : 2009.07.25


This paper addresses the simulation methodology of signal integrity and power integrity for mobile display modules. The proposed technique can be applied to analyse a circuit module which consist of connector, FPCB and driver ICs. The recent demand of serial interconnection technology in the mobile display industry needs delicate impedance control of signal and power traces to prohibit system malfunctioning and to reduce electromagnetic field radiation. Based on the S-parameter and Z-parameter analysis, we analyse the correlation between frequency-domain and time-domain measurements. With multi-port macros, signal integrity can be included in power integrity analysis in time domain.


  1. Grivet-Talocia, S. Acquadro, M. Bandinu, F.G. Canavero, I. Kelander, M. Rouvala, 'Signal Integrity constrained optimization of flexible printed interconnects for mobile devices,' IEEE International Symposium on EMC, Portland, USA, August 2006
  2. Grivet-Talocia, 'Delay-Based Macromodels for Long Interconnects via Time-Frequency Decomposition,' IEEE 15th Topical Meeting on Electrical Performance of Electronic Packaging, pp. 199-202, Scottsdale, USA, October 2006
  3. A. Vaidyanath, B. Thorodden and J. L. Prince, 'Effect of CMOS Driver Loading Conditions on Simultaneous Switching Noise,' IEEE Trans. CPMT-PART B. vol.17, No.4, pp. 480-485, November, 1994
  4. I.S.Stievano, F.G.Canavero, I.A.Maio, 'Behavioral Macromodels of Digital IC Receivers for Analog-Mixed Signal Simulations,' IEE Electronics Letters, Vol. 41, No. 7, March 2005
  5. K.Y. See, M. Oswal, W. Khan-ngern, F. Canavero, C. Christopoulos, H. Grabinski, 'Impact of PCB Layout Design on Final Product's EMI Compliance,' 17th International Zurich Symposium on Electromagnetic Compatibility, pp. 553-556, Singapore, February 2006
  6. Grivet-Talocia, F. Canavero, S. Acquadro, C. Peraldo, M. Rouvala, I. Kelander, 'Parametric Macromodeling of Flexible Printed Interconnects for Mobile Devices,' International Symposium on Electromagnetic Compatibility, pp. 851-856, Barcelona, Spain, September 2006