DOI QR코드

DOI QR Code

Characteristic Properties of TiN Thin Films Prepared by DC Magnetron Sputtering Method for Hard Coatings

Hard Coating 응용을 위한 DC 마그네트론 스퍼터링 방법을 이용하여 증착한 TiN 박막의 특성에 대한 연구

  • 김영렬 (성균관대학교 정보통신공학부) ;
  • 박용섭 (성균관대학교 정보통신공학부) ;
  • 최원석 (한밭대학교 전기공학부) ;
  • 홍병유 (성균관대학교 정보통신공학부)
  • Published : 2008.07.01

Abstract

Titanium nitride (TiN) thin films are widely used for hard coatings due to their superior hardness, chemical stability, low friction and good adhesion properties. In this study, we investigated the effect of DC power on the characteristics of TiN thin films deposited on Si and glass substrates by DC magnetron sputtering using TiN target. We made TiN films of 300 nm thickness with various DC powers. The structural properties of films are investigated by x-ray diffractions (XRD) and tribological properties are measured by nano-indentation, nano-scratch tester. The rms roughness was measured by atomic forced microscopy (AFM). In the result, TiN films had the smooth surface and exhibited (111) directions with the increase of DC Power. Also, especially in case of 175 W DC power, TiN film exhibited the maximum hardness about 8 GPa, and the critical load near 25.

References

  1. T. Polcar, T. Kubart, R. Novák, L. Kopecky, and P. Siroky, 'Comparison of tribological behaviour of TiN, TiCN and CrN at elevated temperatures', Surf. Coat. Tech., Vol. 193, p. 192, 2005 https://doi.org/10.1016/j.surfcoat.2004.07.098
  2. F. Vaz, J. Ferreira, E. Ribeiro, L. Rebouta, S. Lanceros-Méndez, J. A. Mendes, E. Alves, Ph. Goudeau, et al, 'Influence of nitrogen content on the structural, mechanical and electrical properties of TiN thin films', Surf. Coat. Tech., Vol. 191, p. 317, 2002 https://doi.org/10.1016/j.surfcoat.2004.01.033
  3. A. Kagiyama, K. Terakadoa, and R. Uraob, 'Effect of nitriding and TiN coating temperatures on the corrosion resistance of the combined surface modification layer', Surf. Coat. Tech., Vol. 169-170, p. 397, 2003 https://doi.org/10.1016/S0257-8972(03)00134-8
  4. J. W. Uhm and H. T. Jeon, 'TiN Diffusion barrier grown by atomic layer deposition method for Cu metallization', Jpn. J. Appl. Phys., Vol. 40, p. 4657, 2001 https://doi.org/10.1143/JJAP.40.4657
  5. K.-Y. Chan and B.-S. Teo, 'Atomic fore microscopy (AFM) and X-ray diffraction (XRD) investigations of copper thin films prepared by dc maganetron sputtering technique', Microelectronics Journal, Vol. 35, p. 1064, 2006
  6. M. Nakamura, T. Aoki, Y. Hatanaka, D. Korzec, and J. Engemann, 'Comparison of hydrophilic properties of amorphous TiOx films obtained by radio frequency sputtering and plasma-enhanced chemical vapor deposition', J. Mater. Resi., Vol. 16, p. 621, 2001 https://doi.org/10.1557/JMR.2001.0089
  7. W. Zhou, X. Zhong, X. Wu, L. Yuan, Z. Zhao, H. Wang, Y. Xia, Y. Feng, J. He, and Wangtao, 'The effect of surface roughness and wettability of nanostructured $TiO_2$ film on TCA-8113 epithelial-like cells', Surf. Coat. Tech., Vol. 200, p. 6155, 2006 https://doi.org/10.1016/j.surfcoat.2005.09.029
  8. Efeoglu and R. D. Arnellb, 'Multi-pass sub-critical load testing of titanium nitride coatings', Thin Solid Films, Vol. 377-378, p. 346, 2000 https://doi.org/10.1016/S0040-6090(00)01309-2
  9. J. Y. Yun, B. H. Kim, J. H. Seo, J. M. Lee, S. B. Kang, G. H. Choi, U. I. Chung, and J. T. Moon, 'Investigation of the contact resistance between Ti/TiN and Ru in metal-1/plate contacts of ruthenium insulator silicon capacitor', Jpn. J. Appl. Phys., Vol. 42, p. 1874, 2003 https://doi.org/10.1143/JJAP.42.1874
  10. 김창조, 조병철, 김좌연, 윤희종, 이재길, 'Cu와 Si 사이에서 확산 방지막으로 사용하기 위한 TiN/Zr(N)/TiN 다층박막의 연구', 전기전자재료학회논문지, 12권, 8호, p. 663, 1999
  11. 이근우, 박수진, 유정주, 권영호, 김주연, 전형탁, 배규식, '$NH_3$ 분위기에서 Ti 질화에 의한 TiN 형성', 전기전자재료학회논문지, 17권, 2호, p. 150, 2004
  12. 송찬일, 김창석, 정천옥, 김병안, 'TiN이 증착된 SiO/TiN 박막의 전압-전류 특성', 전기전자재료학회논문지, 12권, 2호, p. 145, 1999