Preparation and Characterization of Surface Modified Mica by Microwave-enhanced Wet Etching

마이크로웨이브로 증폭된 습식 에칭에 의한 표면 개질 마이카의 제조와 특성

  • 전상훈 (아모레퍼시픽 기술연구원) ;
  • 권순상 (아모레퍼시픽 기술연구원) ;
  • 김덕희 (아모레퍼시픽 기술연구원) ;
  • 심민경 (아모레퍼시픽 기술연구원) ;
  • 최영진 (아모레퍼시픽 기술연구원) ;
  • 한상훈 (아모레퍼시픽 기술연구원)
  • Published : 2008.12.30

Abstract

In this study we successfully altered the structural characteristics of the mica surface and were able to control oil-absorption by using the microwave enhanced etching (MEE) technique, which has originally been used in semiconductor industry. When microwave energy is applied to the mica, the surface of the mica is etched in a few minutes. As the result of etching, oil-absorption of the mica was enhanced and surface whiteness was improved by modifying the silicon dioxide layer. Additionally, the high whiteness was maintained even though the etched mica absorbed the sebum or sweat. The surface modification of mica was performed by microwave irradiation after the treatment of hydrofluoric acid. The degree of etching was regulated by acid concentration, irradiation time, the amount of energy and slurry concentration. The surface morphology of the etched mica appears to be the shape of the 'Moon'. The characteristics of surface area and roughness were examined by Brunauer-Emmett-Teller (BET) surface area analysis, atomic force microscopy (AFM), scanning electron microscopy (SEM), spectrophotometer and goniophotometer.

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