Development of Diagnosis System Adopted Intelligent Smart Junction Box for Improving Vehicular Power Safety

차량 전원 안정성 향상을 위한 Diagnosis System 채택 Intelligent Smart Junction Box 개발

  • Published : 2008.02.01


These days the automobile industry, which has rapidly progressed, has been an indispensable part in social and economic activities as well as its research and development have been activated in response to various needs of consumers and markets. The second and third generation control system, getting count on safety and convenience differently than early circuits, cause the hypertrophy of wire harness. The J/Box(Junction Box), which distributes power and wires, was developed to solve the problem. As vehicles have been better in quantity and intelligence, however, environment-friendly electric apparatus system has continuously increased and ITS(Intelligent Transport System) has been introduced in earnest. In result, wires got complicated and multilateral and also there has been a stronger probability that vehicles are out of order due to various problems including mechanical failure. In this study, ISJB(Intelligent Smart Junction Box) was introduced to solve the problem. The diagnosis system was applied to prevent the overload and short of ISJE. Also, the state of vehicles displayed so that drivers monitor it in motion. Likewise error data are saved in the memory so that such data can be analyzed retrospectively. The busbar was adopted in to the main power terminal and the part of power pattern was coverd by lead. Because ISJB is more sensitive to heat in comparison to the busbar type J/Box. With regard the circuits related with safe, alternative circuits were set up in order that electronic devices may be normally operated even when an error arises. ISJB is expected to improve the safety and quality of vehicles.


  1. 요시하키 사와키, "일본 내 Junction Box Trend", 후루카와 내부 연구 보고서, pp1-35, January 2004
  2. 박원장 "자동차용 전장부품의 기술동향 및 경쟁력 분석", 산업연구원, pp1-101, April 1987
  3. 오영관, "자동차용 반도체 '가속페달'을 밟아라", 자동차용 반도체 및 전자부품 선택 가이드, pp34-39, 2006
  4. 김병우, "미래형 자동차의 반도체 동향", 자동차용 반도체 및 전자부품 선택가이드, pp40-45, 2006
  5. Pradeep Lall, "Tutorial: Temperature As an Input to Microelectronics-Reliability Models," IEEE Trans. on Reliability, Vol. 45, no. 1, pp.3-9, March 1996
  6. Allan D. Kraus and Avram Bar-Cohen, Thermal Analysis and Control of Electronic Equipment, Hemisphere Publishing Co., p573, 1983
  7. Younes Shabany, "Component Size and Effective thermal conductivity of Printed circuit boards," in Proc. of ITHERM 2002, pp. 489-494, San Diego, USA, May 2002
  8. K. Azar and J. E. Graebner, "Experimental Determination of Thermal Conductivity of Printed Wiring Boards," in Proc. of Twelfth IEEE SEMI-THERM Symposium, 1996, pp.169-182, Austin, USA, March 1996
  9. 김주년, 김보관, "열전도 환경을 고려한 전장탑재물의 소자 열 해석", 대한 전자공학회 논문지, 제 43권 SC편, pp.60-67, 2006.09
  10. Luigi Guarrasi & Doriana Montella, "자동차 환경의 벌브용 PWM", 자동차용 반도체 및 전자부품 선택 가이드, pp46-52, 2006
  11. 이재춘, "지능형 세탁기용 인버터 전력모듈 설계에 관한 연구", 한양대학교 학위논문, pp.1-61,2000.08
  12. 임상진, 이형철 "차량용 Permanent-magnet synchrinous motor 제어 시스템의 센서고장 진단", 한국자동차 공학회, pp1429-1434, 2006
  13. Mark L. Montrose, "EMC를 고려한 PCB 설계기술" 진안엠엔비, 2006
  14. 구자원, 신승우, 김병수, "전장품 열 분석 및 시험 기법", 한국자동차 공학회, pp1263-1268, 2005
  15. Dept of FEA, " Selected Problems for ANSYS Users", Ohmsa, pp85-90, 2005