Influence of Laminating and Sintering Condition on Permittivity and Shrinkage During LTCC Process

LTCC 공정 중 적층 및 소결이 유전율과 회로 형상에 미치는 영향

  • Published : 2007.08.01


LTCC(Low Temperature Co-fired Ceramic) which offers a good performance to produce multilayer structures with electronic circuits and components has emerged as an attractive technology in the electronic packaging industry. In LTCC module fabrication process, the lamination and the sintering are very important processes and affect the electrical characteristics of the final products because the processes change the permittivity of ceramics and the dimension of the circuit patterns which have influences on electronic properties. This paper discusses the influence of lamination pressure and sintering temperature on the permittivity and the dimensional change of LTCC products. In the present investigation, it is shown that the permittivity increases along with increasing of the lamination pressure and the sintering temperature.


  1. 백승욱, 임성한, 오수익, 2005, LTCC 기판의 미세 비아홀 펀칭 중 공정 변수의 영향 평가, 한국소성가공학회지, 제14권, 제3호, pp. 277-281
  2. 신승용, 임성한, 주병윤, 오수익, 2004, 미세비아홀 펀칭 공정 중 이종 재료 두께에 따른 버 생성, 한국소성가공학회지, 제13권, 제1호, pp. 65-71
  3. Y. Wang, 2002, Research of LTCC/Cu, Ag multilayer substrate in microelectronics packaging, Mat. Sci. Eng, Vol. 94, pp. 48-53
  4. A. W. Tavernor, 1999, Improved Compaction in Multilayer Capacitor Fabrication, J. Eu. Ceram. Soc Vol. 19, pp. 1691-1695
  5. I. S. Cho, 2004, Low-temperature sintering and microwave dielectric properties of BaO $\cdot$(NdlxBix)2O3 $\cdot$ 4TiO2 by the glass additions, Cer. Int., Vol. 30, pp. 1181-1185
  6. E.S. Kim, 2003, Porosity dependence of microwave dielectric properties of complex perovskite (Pb0.5Ca0.5)(Fe0.5Ta0.5)O3 ceramics, Mat. Che. Phys., Vol. 79, pp. 213-217
  7. R. A. Gardner and R. W. Nufer, 1974, Properties of Multilayer Ceramic Green Sheet, Solid State Technology, pp. 38-43
  8. Y. Oyanagi, 1996, Introduction to Polymer Processing Rheology, Agun, Tokyo
  9. A. J. Bosman and E. E. Havinga, 1963, Temperature Dependece of Dielectric Constant of Cubic Ionic Compounds, Phys. Rev, Vol. 294, pp. 1593-1600
  10. J. S. Sung, K. D. Koo, 1997, Changes of Camber on Lamination Condition in Alumina/tungsten Cofiring Multilayer Package, J. Kor. Cer. Soc, Vol. 34, pp. 601-610