Plating Solution Composition Control of Tin-Cobalt Alloy Electroplating Process

Tin-Cobalt 합금 도금공정에서 도금물성 향상을 위한 최적 용액조성 디자인

  • Lee, Seung-Bum (Department of Chemical Engineering, Dankook University) ;
  • Hong, In-Kwon (Department of Chemical Engineering, Dankook University)
  • 이승범 (단국대학교 공과대학 화학공학전공) ;
  • 홍인권 (단국대학교 공과대학 화학공학전공)
  • Received : 2005.10.27
  • Accepted : 2006.03.22
  • Published : 2006.04.10

Abstract

The alternate plating method was suggested by a tin-cobalt alloy plating process which has excellent mechanical characteristics and also favorable to environment. Tin-cobalt alloy plating has many advantages such as nontoxicity, variable color-tone, and no post-treatment process. In this study, the plating conditions such as temperature, pH, current density, plating time, and amount of additive (glycine) were determined in the tin-cobalt alloy plating process through Hull-cell test and surface analysis. As the result of Hull-cell analysis, brightness became superior as the amount of glycine increased. It was found that the optimum alloy ratio was 0.03 M of $SnCl_{2}{\cdot}2H_{2}O$ and 0.05 M of $CoSO_{4}{\cdot}7H_{2}O$ at $50^{\circ}C$, pH 8.5, and $0.5A/dm^2$. The optimum amount of additive was 15 g/L of glycine and 0.1 g/L of organic acid. Then, the solution including glycine was recommended as an optimum plating solution for a chromium plating process.

Acknowledgement

Supported by : 단국대학교

References

  1. M. Schlesinger and M. Paunovic, Modern Electroplating, 4th ed., John Wiley & Sons, Inc., NewYork (2000)
  2. M. Clark, R. C. Elbourne, and C. A. Mackay, Trans. Instit. Metal. Finish, 50, 180 (1972) https://doi.org/10.1080/00202967.1972.11870245
  3. M. Jordan, The Electrodeposition of Tin and its Alloy, ed. G. Eugen, Leuze Publishers, Germany (1995)
  4. S. K. Cho, S. C. Kwon, K. J. Park, and J. I. Park, J. Korean Institute of Surface Eng., 33, 157 (2000)