Journal of the Korean Society for Industrial and Applied Mathematics
- Volume 10 Issue 1
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- Pages.31-45
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- 2006
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- 1226-9433(pISSN)
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- 1229-0645(eISSN)
3-D Solder Paste Inspection Based on B-spline Surface Approximation
B-spline 표면 근사화 기반의 3차원 솔더 페이스트 검사
- Published : 2006.08.25
Abstract
Recently advanced device and sophisticated manufacture process by high-density, high-integration require critical inspection criteria in SMT(surface mounting technologies). Especially for solder paste which come out over 60% of inferior goods of all product, 3-dimensional inspection replaces 2-D inspection as a effectiveness substitute of this trend. Therefore this paper proposes a fast 3-D inspection system and measurement algorithm automatically inspecting 3-D solder paste of PCB in SMT assembly line. The proposed method generates 3-D surface of data using B-spline algorithm and then extracts to inspect the pad.