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Formation of Fine Pitch Solder Bump with High Uniformity by the Tilted Electrode Ring

경사진 전극링을 이용한 고균일도의 미세 솔더범프 형성

  • 주철원 (한국전자통신연구원 기반기술연구소) ;
  • 이경호 (한국전자통신연구원 기반기술연구소) ;
  • 민병규 (한국전자통신연구원 기반기술연구소) ;
  • 김성일 (한국전자통신연구원 기반기술연구소) ;
  • 이종민 (한국전자통신연구원 기반기술연구소) ;
  • 강영일 (한국전자통신연구원 기반기술연구소)
  • Published : 2005.09.01

Abstract

The plating shape in the opening of photoresist becomes gradated shape in the fountain plating system, because bubbles from the wafer surface are difficult to escape from the deep openings, vias. In this paper, the bubble flow from the wafer surface during plating process was studied and we designed the tilted electrode ring to get uniform bump height on all over the wafer and evaluated the film uniformity by SEM and $\alpha-step$. In a-step measurement, film uniformities in the fountain plating system and the tilted electrode ring contact system were $\pm16.6\%,\;\pm4\%$ respectively.

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