Electro-chemical Mechanical Deposition for Planarization of Cu Interconnect

Cu 배선의 평탄화를 위한 ECMD에 관한 연구

  • 정석훈 (부산대학교 정밀기계공학과) ;
  • 서헌덕 (부산대학교 정밀기계공학과) ;
  • 박범영 (부산대학교 정밀기계공학과) ;
  • 박재홍 (부산대학교 정밀기계공학과) ;
  • 박성민 (부산대학교 정밀기계공학과) ;
  • 정문기 (부산대학교 미세기계전자시스템 협동과정) ;
  • 정해도 (부산대학교 정밀정형 및 금형가공 연구소) ;
  • 김형재
  • Published : 2005.09.01


This study introduces Electro-chemical Mechanical Deposition(ECMD) lot making Cu interconnect. ECMD is a novel technique that has ability to deposit planar conductive films on non-planar substrate surfaces. Technique involves electrochemical deposition(ECD) and mechanical sweeping of the substrate surface Preferential deposition into the cavities on the substrate surface nay be achieved through two difference mechanisms. The first mechanism is more chemical and essential. It involves enhancing deposition into the cavities where mechanical sweeping does not reach. The second mechanism involves reducing deposition onto surface that is swept. In this study, we demonstrate ECMD process and characteristic. We proceeded this experiment by changing of distribution of current density on divided water area zones and use different pad types.


  1. Kim H. Y., Hong J. H., Moon S. T., Han J. w., and Kim K. H. 'Cu CMP characteristics and electrochemical plating effect', Proc. 2004 Summer Conf. KIEEME, p. 252, 2004
  2. B. Basol, C. Uzoh, H. Talieh, T. Wang, G. Guo, S. Erdemli, D. Mai, P. Lindquist, J. Bogart, M. Cornejo, M. Cornejo, and E. Basol, 'Planar copper electrodeposition and electropolishing technique', The national AIChE Meeting, san Francisco, CA., Symposium on Metallization in semiconductor device fabrication, p. 192, 2003
  3. B. M. Basol, C. E. Uzoh, H. Talieh, D. Young, P. Lindequist, T. Wang, and M. Cornejo, 'Electrochemical mechanical deposition technique for semiconductor interconnect applications', Microelectronic Engineering, Vol. 64, Iss. 1-4, p. 42, 2002
  4. C. E. Uzoh, H. Talieh, and B. M. Basol, 'Anode designs for planar metal deposits with enhanced electrolyte solution blending and process of supplying electrolyte solution using such designs', U. S. Patent 6,695,962 B2, 2004
  5. C. E. Uzoh, T. Wang, J. Ashjace, H. Talieh, and B. M. Basol, 'Planarized copper layers for interconnect fabrication', NIKKEI MICRO-DEVICES 2004, p. 103, 2004
  6. Y. Dordi and P. Hey, 'Automated Chemical Management for Production Copper Electroplating', Semiconductor Fabtech-11th Edition p. 273, 1999
  7. 손상기, 이유용, 조병원, 이재봉, 이태희, '전기구리도금에 미치는 Mercapto 화합물의 전기화학적 특성', 한국전기화학회지, 4권, 4호, p.160, 2001
  8. L. A. Gochberg, 'Modeling of uniformity and scale-up in a 300 mm copper electroplating tool', The 1999 Joint International Meeting, Vol. 99-2, Abstract No. 900, p. 900, 1999