Micro Structure and Surface Characteristics of NiCr Thin films Prepared by DC Magnetron Sputter according to Annealing Conditions

DC 마그네트론 스퍼터링 NiCr 박막의 열처리 조건에 따른 미세구조 및 표면특성

  • 권용 (조선대학교 신소재공학과) ;
  • 김남훈 (조선대학교 에너지자원신기술연구소) ;
  • 최동유 (조선대학교 에너지자원신기술연구소) ;
  • 이우선 (조선대학교 전기공학과) ;
  • 서용진 (대불대학교 전기전자공학과) ;
  • 박진성 (조선대학교 신소재공학과)
  • Published : 2005.06.01


Ni/Cr thin film is very interesting material as thin film resistors, filaments, and humidity sensors because their relatively large resistivity, more resistant to oxidation and a low temperature coefficient of resistance (TCR). These interesting properties of Ni/Cr thin films are dependent upon the preparation conditions including the deposition environment and subsequent annealing treatments. Ni/Cr thin films of 250 nm were deposited by DC magnetron sputtering on $Al_2O_3/Si$ substrate with 2-inch Ni/Cr (80/20) alloy target at room temperature for 45 minutes. Annealing treatments were performed at $400^{\circ}C,\;500^{\circ}C,\;and\;600^{\circ}C$ for 6 hours in air or $H_2$ ambient, respectively. The clear crystal boundaries without crystal growth and the densification were accomplished when the pores were disappeared in air ambient. Most of surface was oxidic including NiO, $Ni_2O_3$ and $Cr_xO_y$(x=1,2, y=2,3) after annealing in air ambient. The crystal growth in $H_2$ ambient was formed and stabilized by combination with each other due to the suppression of oxidized substance on film surface. Most oxidic Ni was restored when the oxidic Cr was present due to its stability in high-temperature $H_2$ ambient.


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