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A Study on the Ball-off of Via Balls Bonded by Solder Paste

Solder Paste로 접합된 비아볼의 Ball-off에 관한 연구

  • 김경수 (광운대학교 전자재료공학과) ;
  • 김진영 (광운대학교 전자재료공학과)
  • Published : 2004.06.01

Abstract

Package reliability test was conducted to investigate the effect of solder paste composition at BGA Package. It was found that the shape and size of the phase form are affected by the processing parameters. The material have used to fill in the via was Sn/36Pb/2Ag and Sn/0.75Cu type solder paste. Sn/36Pb/2Ag and Sn/0.75Cu paste were fabricated on Tape-BGA substrates by screen printing process, and via ball mount data were characterized with variations of dwell time of 85 seconds at reflow peak temperature at 22$0^{\circ}C$ or 24$0^{\circ}C$. The test condition was MRT 30 $^{\circ}C$/60 %RH/96 HR. Failures formed of a ball-off in solder paste process were observed by using a Optical Microscope and SEM(Scanning Electron Microscope). It was concluded that intermetallic layer growth played important roles in increasing solder fatigue strength for addition of Ag composition. The degradation of shear strength of solder composition is discussed.

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Cited by

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  2. Laser-assisted deposition of Cu bumps for microelectronic packaging vol.22, 2012, https://doi.org/10.1016/S1003-6326(12)61786-5