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Atomistic Modeling of Spherical Nano Abrasive-Substrate Interaction

절삭용 구형나노입자와 기판 상호작용에 관한 원자단위 모델링

  • 강정원 (중앙대학교 전자전기공학부) ;
  • 송기오 (중앙대학교 전자전기공학부) ;
  • 최원영 (중앙대학교 전자전기공학부) ;
  • 변기량 (중앙대학교 전자전기공학부) ;
  • 이재경 (중앙대학교 전자전기공학부) ;
  • 황호정 (중앙대학교 전자전기공학부)
  • Published : 2003.12.01

Abstract

This paper shows the results of atomistic modeling for the interaction between spherical nano abrasive and substrate in chemical mechanical polishing processes. Atomistic modeling was achieved from 2-dimensional molecular dynamics simulations using the Lennard-Jones 12-6 potentials. The abrasive dynamics was modeled by three cases, such as slipping, rolling, and rotating. Simulation results showed that the different dynamics of the abrasive results the different features of surfaces. This model can be extended to investigate the 3-dimensional chemical mechanical polishing processes.

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