Design of Multilayer Ceramic Chip Band Pass Filter with an Attenuation Pole

감쇠극을 갖는 적층형 세라믹 칩 필터의 설계

  • 강종윤 (한국과학기술연구원 박막재료연구센터) ;
  • 심성훈 (한국과학기술연구원 박막재료연구센터) ;
  • 최지원 (한국과학기술연구원 박막재료연구센터) ;
  • 박용욱 (남서울대학교 전자정보통신공학부) ;
  • 이동윤 (중부대학교 정보공학부) ;
  • 윤석진 (한국과학기술연구원 박막재료연구센터) ;
  • 김현재 (한국과학기술연구원 박막재료연구센터)
  • Published : 2003.08.01


A multi-layer ceramic (MLC) chip type band-pass filter (BPF) is presented. The MLC chip BPF has the benefits of low cost and small size. The BPF consists of coulped stripline resonators and coupling capacitors. The BPF is designed to have an attenuation pole at below the passband for a receiver band of IMT-2000 handset. The computer-aided design technology is applied for analysis of the BPF frequency characteristics. The passband and attenuation pole depend on the coupling between resonators and coupling capacitance. The frequency characterics of the passband and attenuation pole are analyzed with the variation of the coupling between resonators and coupling capacitance. An equivanlent circuit and structure of MLC chip BPF are proposed. The frequency characteristics of the BPF is well acceptable for IMT-2000 application.


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