Abstract

The purpose of this paper is to investigate the solder properties by the change of P mass percentage. Tension test, wetting balance test, spread test, and analysis of intermetallic compound after isothermal aging of Sn-2.5Ag-0.7Cu-0.005P, Sn-2.5Ag-0.7Cu-0.01P, Sn-2.5Ag-0.7Cu-0.02P, Sn-0.7Cu-0.005P were performed. Adding P in the solder alloys resulted in improvement of tensile strength, reduction of intermetallic compound growth, reduction of oxidization in fusible solders under wave soldering. After comparing solder alloy containing P with tin-lead eutectic solder alloy, P contained solders alloys showed much better solder properties than eutectic solder alloy. Furthermore, this solder alloy presented remarkable properties than any other lead-free solder alloy.

Keywords

• Lead-free Solder;
• Solderability;
• Wetting balance test;
• Intermetallic compound(IMC)

File

Download PDF

References

1. Principles of Soldering and Braizing Gilles Humpston;David M.Jacobson
2. International Materials Reviews Metallurgy of low temperature Pb-free solders for electronic assembly J.Glazer
3. Sandia Report, SAND96-1431 J.A.Kern;M.W.Weiser;C.A.Drewien;F.J.Yost;S.Sackinger
4. ASTM E8-98 Standard Test Method for Tension Testing of Metallic Materials American Society For Testing and Materials
5. 전기전자재료학회논문지 v.6 no.6 전자부품의 접합재료로서의 Sn도금막 형성 조건 및 도금막 특성에 관한 연구 신영의;임민빈;김경섭;Shuji Nakata
6. 전기전자재료학회 99 춘계학술대회논문집 무전해 니켈/금도금에서의 내부 금속층의 결함에 대한 연구 박수길;정승준;김재용
7. J. Electron mater Characterization of eutectic Sn-Bi solder joint Z.Mei;J.W.Morris
8. Matterials Transaction v.42 The effect of Bi concentration on wettability of Cu substrate by Sn-Bi solder Chang-Bae Lee;Seung-Boo Jung;Young-Eui Shin;Chang-Chae Shur https://doi.org/10.2320/matertrans.42.751
9. 대한용접학회지 v.2 no.1 등온시효에 따른 Sn-3.5Ag 솔더 접합부의 금속간 화합물 성장에 관한 연구 이인영;이창배;정승부;서창제