Laser-Induced Direct Copper Patterning Using Focused $Ar^+$ Laser Beam

집속 아르곤 이온 레이저 빔을 이용한 레이저 유도 직접 구리 패터닝

  • 이홍규 (인하대학교 전기공학과) ;
  • 이경철 (인하대학교 전기공학과) ;
  • 안민영 (인하대학교 전기공학과) ;
  • 이천 (인하대학교 전기공학과)
  • Published : 2000.11.01

Abstract

Laser direct writing of micro-patterned copper lines has been achieved by pyrolytic decomposition of copper formate films (Cu(HCOO)$_2$.4$H_2O$), as a metallo-organic precursor, using a focused CW Ar$^{+}$ laser beam (λ=514nm) on PCB boards and glass substrates. The linewidth and thickness of the lines wee investigated as a functin of laser power and scan speed. The profiles of the lines were measured by scanning electron microscope (SEM), surface profiler ($\alpha$-step) and atomic force measured by scanning electron microscope (SEM), surface profiler ($\alpha$-step) and atomic force microscopy (AFM). The electrical resistivities of the patterned lines were also investigated as a function of laser parameters using probe station and semiconductor analyzer. We compared resistivities of the patterned copper lines with these of the Cu bulk. Resistivities decreased due to changes in morphology and porosity of the deposit, which were about 3.8 $\mu$$\Omega$cm and 12$\mu$$\Omega$cm on PCB and glass substrates after annealing at 30$0^{\circ}C$ for 5 minutes.s.