Fabrication and evaluation of microstructural evolution and critical property of twisted Bi-2223 superconductor tape

Twisting된 Bi-2223 선재의 제조, 미세조직 관찰 및 임계 특성평가

  • 임준형 (성균관대학교 금속재료공학부) ;
  • 지봉기 (성균관대학교 금속재료공학부) ;
  • 박형상 (성균관대학교 금속재료공학부) ;
  • 주진호 (성균관대학교 금속재료공학부) ;
  • 장미혜 (연세대학교 기전공학부) ;
  • 고태국 (연세대학교 기전공학부) ;
  • 이상진 (위덕대학교 전기공학과) ;
  • 하홍수 (한국전기연구소 초전도응용연구사업팀) ;
  • 오상수 (한국전기연구소 초전도응용연구사업팀)
  • Published : 2000.03.01

Abstract

We fabricated Bi-2223 multi-filaments superconductor tape and evaluated the effect of twisting on the microstructural evolution and critical current. Twist pitches of the tapes are in the range of 70- 8mm and uniformly deformed. It was observed that grain size and the degree of texture decreased as decreasing pitch probably due to the formation of the irregular interface between Ag and filaments. In addition critical current of the tapes decreased to 6.5 A with decreasing pitch to 8mm, showing 48% of degradation compared to the untwisted tapes decreased to 6.5 A with decreasing pitch to 8mm, showing 48% of degradation compared to the untwisted tape(12.5 A). These reduction of critical current may be related to the interface irregularity smaller grain size worse texture and the presence of cracks due to the induced strain during twisting processing.

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