The Characteriastics of Viscosity Behavior of EMC for Semi-conductor Encapsulant - Containing One Kind of Spherical Silica

반도체 봉지재용 EMC의 점도거동 특성 - 한 종류의 구형 실리카 포함

  • Kim, In Beom (Department of Chemical Engineering, Dongguk University) ;
  • Lee, Myung Cheon (Department of Chemical Engineering, Dongguk University) ;
  • Lee, Euy Soo (Department of Chemical Engineering, Dongguk University)
  • Received : 1999.08.13
  • Accepted : 1999.11.10
  • Published : 1999.12.10

Abstract

The rheological properties of highly filled epoxy molding compound(EMC) for semi-conductor encapsulants are greatly affected by the content of filler loaded. In this study, the change of viscosity of EMC for semi-conductor encapsulants with the filler content was investigated. Also, both of Cox-Merz and modified Cox-Merz equations were applied to convert the viscosity change as a function of frequency to that of shear rate. It was ovserved that shear thinning and yield stress occured at high filler contents and that the Cox-Merz equation could not be applied at high filler contents because of the difference of viscosity according to the various strains. When the modified Cox-Merz equation was applied, the all the curves having different strain tend to be represented by one master curve, even though some deviation was obseved at high filler content and strain.

Keywords

EMC;viscosity;encapsulant;Cox-Merz rule;semi-conductor

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