The Characteristics of Viscosity Behavior of EMC for Semi-conductor Encapsulant -The Prediction of Viscosity by Mooney Equation-

반도체 봉지제용 EMC의 점도거동 특성 연구 -Mooney식을 이용한 점도예측-

  • Kim, In Beom (Department of Chemical Engineering, Dongguk University) ;
  • Bae, Doo Han (Department of Chemical Engineering, Dongguk University) ;
  • Lee, Myung Cheon (Department of Chemical Engineering, Dongguk University) ;
  • Lee, Euy Soo (Department of Chemical Engineering, Dongguk University) ;
  • Yun, Hyo Chang (Central Research Institute, Korea Chemical Co.) ;
  • Lim, Jong Chan (Central Research Institute, Korea Chemical Co.)
  • Received : 1999.08.11
  • Accepted : 1999.09.11
  • Published : 1999.10.10

Abstract

Because epoxy molding compound(EMC) for semi-conductor encapsulants contains high concentrations of fillers, its flow behaviors are affected much by the concentrations and properties of those fillers. This paper reports the effects of a filler concentration, shape, size, and size distributions on the viscosity behavior of EMC(epoxy/silica). In addition, the prediction of viscosity behavior was performed using the Mooney equation. The maximum packing volume in the Mooney equation was calculated by Ouchiyama's packing model and Taguchi's optimization method, while the shpae factor was determined by fitting the experimental data. The results showed that the Mooney equation predicted the viscosity behavior of EMC very well.

Keywords

EMC encapsulant;Mooney;viscosity

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