Journal of the Korean Institute of Electrical and Electronic Material Engineers (한국전기전자재료학회논문지)
- Volume 11 Issue 7
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- Pages.517-521
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- 1998
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- 1226-7945(pISSN)
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- 2288-3258(eISSN)
Abstract
After etching Al-Cu alloy films using
File
References
- J. Appl. Phys. v.52 no.4 Reactive ion etching induced corrosion of Al and Al-Cu films Lee, W. Y.(et al.)
- Jpn. J. Appl. Phys. v.21 no.10 Aluminum reactive ion etching employing CCl₄+Cl₂mixture Horike, Y.(et al.)
- J. Electrochem. Soc. v.130 no.8 Reactive ion etching of copper films Schwartz, J. C.(et al.)
- 月刊 Semiconductor World Al-Si-Cu合金の etching 後處理の 檢討 小林(等)
- 月刊 Semiconductor World Barrier metal 構造 RIE後の after-corrosion 조원(등)