Regeneration of PCB Etchants and Copper Recovery in a Batch-type Electrolytic Cell

회분식 전해조에서 PCB 식각폐수의 재생 및 구리의 회수

  • Nam, Sang Cheol (Dept. of Chem. Eng., College of Eng., Inha Univ.) ;
  • Nam, Chong Woo (Dept. of Chem. Eng., College of Eng., Inha Univ.) ;
  • Tak, Yongsug (Dept. of Chem. Eng., College of Eng., Inha Univ.) ;
  • Oh, Seung Mo (Dept. of Chem. Tech., College of Eng., Seoul National Univ.)
  • 남상철 (인하대학교 공과대학 화학공학과) ;
  • 남종우 (인하대학교 공과대학 화학공학과) ;
  • 탁용석 (인하대학교 공과대학 화학공학과) ;
  • 오승모 (서울대학교 공과대학 공업화학과)
  • Received : 1996.06.14
  • Accepted : 1997.01.28
  • Published : 1997.04.10

Abstract

Anodic regeneration of PCB enchant and cathodic deposition of copper using electrochemical method has been studied. Cu(I)/Cu(II) concentration ratio as a function of Cu(I) oxidation at the anode was measured from the potential difference between platinum and Ag/AgCl/4M KCl electrodes. Chlorine gas evolution was minimized by maintaining Cu(I) concentration above a specific concentration and using non-porous graphite electrode. Dendritic copper deposition was observed at the cathode and the optimum conditions for Cu deposition was identified as the current density of $360mA/cm^2$, and copper concentration of 12 g/l. Titanium was the most effective cathode material which showed a higher current efficiency and copper recovery. The current efficiency decreased with increasing temperature, but the highest power efficiency was achieved at $50^{\circ}C$.

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