A Study on the Kinetics of Copper Ions Reduction and Deposition Morphology with the Rotating Disk Electrode

RDE를 이용한 구리이온의 환원속도 및 전착형태에 관한 고찰

  • 남상철 (인하대학교 화학공학과) ;
  • 엄성현 (인하대학교 화학공학과) ;
  • 이충영 (인하공업전문대학 공업화학과) ;
  • 탁용석 (인하대학교 화학공학과) ;
  • 남종우 (인하대학교 화학공학과)
  • Received : 1997.04.11
  • Accepted : 1997.06.03
  • Published : 1997.08.10

Abstract

Electrochemical characteristics and kinetic parameters of copper ion reduction were investigated with a platinum rotating disk electrode (RDE) in a diffusion controlled region. Reduction of Cu(II) in sulfate had one-step two-xelectron process, while the reduction of Cu(II) in chloride solution was involved two one-electron processes. The transfer coefficient of Cu(II) in sulfate solution was lowest, and the transfer coefficient of Cu(I) in halide solutions had the value of nearly one. In chloride solutions, electrodeposition rate of Cu(II) was about one hundred times faster than Cu(I). Diffusion coefficient increased in the order of Cu(II) in chloride solution, Cu(I) in the iodide, bromide, chloride solution, Cu(II) in sulfate solution. The calculated ionic radii and activation energy for diffusion decreased in the same order as above. Morphological study on the copper electrodeposition indicated that the electrode surface became rougher as both concentration and reduction potential increases, and the roughness of the surface was analyzed with UV/VIS spectrophotometer.

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