A study on the Glass Frit for Thick Film Copper Conductor

후막 구리도체용 유리에 관한 연구

  • Lee, Joon (Department of Industrial Chemistry, Kon Kuk University) ;
  • Lee, Sang Won (Department of Industrial Chemistry, Kon Kuk University)
  • 이준 (건국대학교 공업화학과) ;
  • 이상원 (건국대학교 공업화학과)
  • Received : 1991.07.15
  • Published : 1991.09.30


In order to obtain glasses appropriate to the thick film copper conductors, nine glasses based on both lead borosilicate and leadless borosilicate systems were made and the applicabilities of them were examined in conjunction with the requirements for thick film copper conductors. As the results, it was found that all the glasses are fitted to provide suitable sheet resistance, solderability and solder leach resistance to thick film copper conductors. However, it was turned out that only the lead borosilicate based glasses worked for getting usable aged adhesion strength of copper thick film to the alumina substrate, while copper conductor films made from the other glasses had poor aged adhesion strengths. Particularly cuprous oxide added lead borosilicate glass was considered as one of the most favorable glasses for manufacturing thick film copper conductors.



Supported by : 과학재단