The Effect of Diamine and Solvent on The Synthesis of Polyimides and Their Film Properties

폴리이미드의 합성과 필름의 물성에 미치는 디아민과 용매의 효과

  • Choi, Hyeong-Ki (Department of Industrial Chemistry, College of Engineering, Hanyang University) ;
  • Lee, Ho-Sik (Department of Industrial Chemistry, College of Engineering, Hanyang University) ;
  • Chung, Chang-Nam (Department of Polymer Engineering, College of Engineering, Suncheon University) ;
  • Kim, Jum-Sik (Department of Industrial Chemistry, College of Engineering, Hanyang University)
  • 최형기 (한양대학교 공과대학 공업화학과) ;
  • 이호식 (한양대학교 공과대학 공업화학과) ;
  • 정창남 (순천대학교 공과대학 고분자공학과) ;
  • 김점식 (한양대학교 공과대학 공업화학과)
  • Received : 1991.06.13
  • Published : 1991.09.30

Abstract

Polyamic acids, precursor polymers of polyimides have been obtained by the solution polycondensation of benzophenone tetracarboxylic dianhydride (BTDA) with 4, 4'-diamino diphenyl methane (MDA) and/or 3, 3'-dimethyl benzidine (OTB). The reaction was carried in two solvent systems such as m-cresol and m-cresol/xylene mixture. The results of TGA analysis showed that the polyimide films had good thermal stability with the initial decomposition temperature ranging from $540^{\circ}$ to $590^{\circ}$. According to DSC analysis of polymers, the glass transition temperature was over $340^{\circ}$. Polyimide film samples, showed good mechanical and electrical properties, had over $16Kg/mm^2$ of tensile strength and about 200 KV/mm of dielectric breakdown voltage. The properties of the copolymer from MAD/OTB were better than those of the homopolymer from MDA. And the polymer synthesized in m-cresol had lower properties than that obtained in m-cresol/xylene.

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