A study on the Oxide CMP Characteristics using New Abrasive

새로운 연마제를 이용한 Oxide CMP 특성에 관한 연구

  • 한성민 (대불대학교 전기전자공학과) ;
  • 한상준 (대불대학교 전기전자공학과) ;
  • 박성우 (대불대학교 전기전자공학과) ;
  • 이우선 (조선대학교 전기공학과) ;
  • 서용진 (대불대학교 전기전자공학과)
  • Published : 2006.11.09


CMP(chemical mechanical polishing) process has been attracted as an essential technology of multi-level interconnection. However, the COO(cost of ownership) is very high, because of high consumable cost. Especially, among the consumables, slurry dominates more than 40 %. So, we focused how to reduce the consumption of raw slurry. In this paper, $ZrO_2$, $CeO_2$, and $MnO_2$ abrasives were added de-ionized water (DIW) and pH control as a function of KOH contents. We have investigate the possibility of new abrasive for the oxide CMP application.



Supported by : 한국과학재단