Microstrip Patch Antenna with a Metal Cavity Using Conducting Vias

다수의 도체 비어로 형성된 캐비티가 있는 마이크로스트립 패치 안테나

  • Byun, Woo-Jin (Advanced Radio Technology Department, Electronics and Telecommunications Research Institute) ;
  • Kim, Bong-Soo (Advanced Radio Technology Department, Electronics and Telecommunications Research Institute) ;
  • Eun, Ki-Chan (Advanced Radio Technology Department, Electronics and Telecommunications Research Institute) ;
  • Kim, Kwang-Sun (Advanced Radio Technology Department, Electronics and Telecommunications Research Institute) ;
  • Song, Myung-Sun (Advanced Radio Technology Department, Electronics and Telecommunications Research Institute)
  • 변우진 (한국전자통신 연구원 디지털 방송단) ;
  • 김붕수 (한국전자통신 연구원 디지털 방송단) ;
  • 은기찬 (한국전자통신 연구원 디지털 방송단) ;
  • 김광선 (한국전자통신 연구원 디지털 방송단) ;
  • 송명선 (한국전자통신 연구원 디지털 방송단)
  • Published : 2005.11.05

Abstract

This paper presents the design and fabrication of a cost effective and broad band 8$\times$8 stacked patch array antenna which are backed by a metal cavity operating at 400Hz based on 4 layers LTCC technology. Gain of antenna can be enhanced by using a metal cavity, which can be easily implemented by using LTCC substrates and vias. The broadband performance can be obtained by varying the dimension of patch and the number of layers. Furthermore, to keep the feeding network as smal1 as possible and reduce radiation from feeding network a mirrored patch orientation and embedded micro strip line are adopted, The fabricated antenna is $40\times45\times0.4$ $mm^3$in size. It shows gain 20.4dBi, beam width 10.7deg and impedance bandwidth of l0dE return loss 3.35GHz (40.9$\sim$44.25 GHz), which is about 8% of a center frequency.

Keywords

Array antenna;LTCC;Millimeter wave